t-1 (3 mm) auto insertable led lamps technical data hlmp-e100 hlmp-e150 hlmp-e200 hlmp-e250 hlmp-e300 HLMP-E350 hlmp-e400 hlmp-e450 hlmp-e500 hlmp-e550 features ? t-1 auto insertable ? high light output ? tinted diffused and tinted non-diffused lens options ? wide viewing angle ? variety of colors ? available with straight lead tape and reel options or in bulk description this family of 3 mm led lamps is specially designed for automatic insertion and wave soldering processes. designed with a thick epoxy flange, it is ideal for flush mount auto insertion. applications ? general purpose ? high volume manufacturing device selection guides part number color package luminous intensity typical viewing angle diff. tint iv (mcd @ 20 ma) typ. (degrees) 2 q [1] hlmp-e100 as algaas red x x 42 60 hlmp-e150 x 110 45 hlmp-e200 orange x x 22 60 hlmp-e250 x 28 45 hlmp-e300 high efficiency red x x 12 60 HLMP-E350 (her) x 38 45 hlmp-e400 yellow x x 15 60 hlmp-e450 x 27 45 hlmp-e500 high performance x x 28 60 hlmp-e550 green x 48 45 note: 1. 2 q is the off axis angle where the luminous intensity is 1 / 2 the on axis intensity. 1 / 2 1 / 2
2 absolute maximum ratings at t a = 25 oc high high parameter efficiency red yellow performance as algaas units and orange green red dc forward current 30 20 30 30 ma reverse voltage 5 v (ir = 100 m a) junction temperature, 110 c t jmax storage temperature -40 to +85 c range operating temperature -20 to +85 -40 to +85 c range lead soldering a) dip/drag soldering: 260 c for 5 seconds temperature b) wave solder temperature: 245 c for 3 seconds [1.6 mm (0.063 in.) from seating plane] notes: 1. see figure 4 for maximum current derating vs. ambient temperature. 2. suggested minimum dc current: 10 ma 3. maximum peak pulsed forward current: 50 ma, 30 ma average. package dimensions 2.0 2.54 ?0.3 0.45 0.44 ?0.2 0.4 + 0.1
?0 3.4 ?0.2 cathode marks 0.65 max. ? 3.1 ?0.2 ? 4.4 ?0.3 3.5 ?0.3 5.85 ?0.5 23.0 min. notes:
1. all dimensions are in millimeters (inches).
2. leads are mild steel, solder dipped.
3. all epoxy meniscus may extend about 0.8 mm (0.030 in.)
down the leads. + 0.1
?0.04 1.0 min.
3 optical characteristics at t a = 25 oc luminous peak color spectral luminous intensity wavelength dominant half efficacy part number lv (mcd) [1] l peak (nm) wavelength width h v [3] typ. l d [2] (nm) typ. (lm/w) min. typ. if (ma) typ. hlmp-e100 13.8 42 20 645 637 27 80 hlmp-e150 35.2 110 20 hlmp-e200 5.4 22 10 600 604 37 380 hlmp-e250 13.8 28 10 hlmp-e300 8.6 12 10 635 626 40 145 HLMP-E350 13.8 38 10 hlmp-e400 9.2 15 10 583 585 36 500 hlmp-e450 14.7 27 10 hlmp-e500 10.6 28 10 565 570 28 595 hlmp-e550 17 48 10 notes: 1. the luminous intensity, lv, is measured at the mechanical axis of the lamp package. the actual peak of the spatial radiation pattern may not be aligned with this axis. 2. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the color of the device. 3. the radiant intensity, le, in watts per steradian, may be found from the equation le = lv/ h v , where lv is the luminous intensity in candelas and h v is the luminous efficacy in lumens/watt. electrical characteristics at t a = 25 oc forward capacitance thermal speed of response voltage c (pf) resistance r q j-pin t s (ns) part number vf (volts) vf = 0, ( c/w) time constant f = 1 mhz e -t / t s typ. max. if (ma) typ. typ. hlmp-e1xx 1.80 2.2 20 30 290 30 hlmp-e2xx 1.90 2.4 10 4 290 280 hlmp-e3xx 1.90 2.4 10 11 290 90 hlmp-e4xx 2.00 2.4 10 15 290 90 hlmp-e5xx 2.10 2.7 10 18 290 500
4 figure 1. relative intensity vs. peak wavelength. figure 2. forward current vs. forward voltage. wavelength ?nm relative intensity 1.0 0.5 0 550 600 650 700 high brightness lamps algaas red orange high
efficiency
red wavelength ?nm relative intensity 1.0 0.5 0 500 550 600 650 700 yellow high
performance
green high efficiency lamps 0 90 70 60 40 20 i f ?forward current ?ma 1.5 3.5 2.5 0.5 v f ?forward voltage ?v 0 4.0 yellow high efficiency lamps high
efficiency
red/orange green 1.0 2.0 3.0 10 30 50 80 0 70 60 40 20 i f ?forward current ?ma v f ?forward voltage ?v 1.0 3.0 high brightness lamps as algaas red 1.5 2.0 2.5 10 30 50
5 figure 4. maximum forward dc current vs. ambient temperature. figure 3. relative luminous intensity vs. forward current. relative luminous intensity
(normalized at 10 ma) 0 0 i dc ?dc current per led ?ma 10 20 4.0 2.0 1.0 515 30 3.0 25 0.5 1.5 2.5 3.5 her, orange, yellow, and high
performance green i f ?forward current ?ma 0 0 t a ?ambient temperature ?? 40 80 40 20 10 20 60 30 5 15 25 35 as algaas red r q ja = 559?c/w r q ja = 689?c/w i f ?forward current ?ma 0 0 t a ?ambient temperature ?? 40 80 40 20 10 60 30 5 15 25 35 her, orange, yellow, and high
performance green r q ja = 470?c/w r q ja = 705?c/w r q ja = 300?c/w yellow her, orange,
green 20 relative luminous intensity
(normalized at 20 ma) 0 0 i f ?dc forward current ?ma 10 20 1.0 0.5 30 1.5 high brightness lamps 40 as algaas 2.0
6 taping options straight lead option #002 #2ca #2cd dimension b C C C dimension h 20.5 1.0 18.0 1.0 20.5 1.0 (0.81 0.04) (0.71 0.04) (0.81 0.04) normalized intensity 1 0 angular displacement ?degrees 0.8 0.6 0.5 0.7 0.2 -90 0.1 0.3 0.4 -80 -70 -60 -50 -40 -20 -10 0 -30 10 20 30 40 50 60 70 80 90 0.9 figure 5. representative spatial radiation pattern for 45 viewing angle. units: mm (inches) straight lead 1.5 (0.06) max. 2.5 (0.10) max. 14.0 ?1.7
(0.55 ?0.07) 18.0 ?1.0
(0.71 ?0.04) 6.4 ?1.3
(0.25 ?0.05) 12.7 ?1.0
(0.50 ?0.04) 9.1 ?0.6
(0.36 ?0.03) 0.0 ?1.0
(0.00 ?0.04) 0.0 ?1.0
(0.00 ?0.04) 11.0
(0.43) max. dimension "h"
(see table) 5.1 ?0.7
(0.20 ?0.03) 12.7 ?0.3
(0.50 ?0.01) 2.5 ?0.3
(0.10 ?0.01) cathode
lead 0.7 ?0.2
(0.03 ?0.01) aa view a? ? 4.0 ?0.2
(0.16 ?0.01) typ. tape outline drawing
7 recommended assembly condition ? a single-sided phenolic printed circuit board (pcb) is preferred. double-sided pcb and other materials may cause greater lead stress. recommended through-hole diameter is 0.9 to 2.0 mm. leadlength below the pcb should be 1.5 to 2.0 mm, and the clinching angle (angle between the lead and pcb) should be 30 10 degrees. ? if smt devices and an adhesive are used on the same pcb as these lamps, the adhesive should be cured before the lamps are auto-inserted. if curing must be done after lamp insertion, the cure temperature and time should not exceed 140 c, 100 seconds. this is the temperature of the surface normal to the ir source. solder condition: preheat: temperature ramp rate of 2 to 4 c per second. do not exceed 150 c delta temperature between preheat and solder temperatures. the maximum time at preheat should not exceed 10 seconds. solder: 245 c maximum, 3 seconds (1.6 mm below seating plane). tape & reel (for option #002 only) ammo pack (for all options except #002) package options lead option ammo pack (1000 pcs.) tape & reel (2000 pcs.) straight lead #2c #002 from left side of box,
adhesive tape is facing
upward. made in malaysia anode leds operator .........
hp part # ...........
date code ........
taping date .....
bin .......................
no. of gaps .....
quantity .......... cathode c a + anode lead leaves
the box first. 336 (13.23) 52 (2.05) 140 (5.51) dimensions in millimeters (inches). reeling orientation
clockwise adhesive tape must be
facing towards the
outside of the reel. anode lead leaves
the reel first. protective
cardboard 110 (4.33) dia. 336 (13.23) dia. dimensions in millimeters (inches).
www.semiconductor.agilent.com data subject to change. copyright ? 1999 agilent technologies, inc. 5968-4402e (11/99)
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